期刊文章

• Bardacchino, G., & Garone, E. (2019). A framework for efficient PCB multilayer routing based on the Steiner tree problem. Journal of Electronic Testing: Theory and Applications, 35(1), 1-18.
• Chen, Y., & Wang, Y. (2018). A comparative study of different optimization algorithms for PCB component placement. IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(10), 1664-1674.
• Huang, C., & Chi, L. (2020). A novel approach for high-speed PCB design based on electromagnetic simulation. IEEE Transactions on Electromagnetic Compatibility, 62(1), 265-273.
• Li, X., & Dong, G. (2019). A new thermal analysis method for multilayer PCB based on equivalent thermal conductivity. International Journal of Heat and Mass Transfer, 129, 922-932.
• Shen, Z., & Wang, D. (2018). A review of printed circuit board (PCB) assembly technologies. IEEE Transactions on Electronics Packaging Manufacturing, 41(4), 645-659.

会议论文

• Han, J., & Kim, T. (2021, May). Design and analysis of a novel high-speed PCB layout for 5G applications. In 2021 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (pp. 1-4). IEEE.
• Li, Q., & Zhang, S. (2020, November). Thermal optimization of multilayer PCB based on genetic algorithm. In 2020 IEEE 23rd International Conference on Electronic Packaging Technology (ICEPT) (pp. 1-4). IEEE.
• Lu, S., & Wang, J. (2019, July). A novel PCB component placement algorithm based on particle swarm optimization. In 2019 International Conference on Intelligent Computing and Signal Processing (pp. 270-275). IEEE.
• Wang, X., & Chen, Y. (2018, October). A review of PCB design and manufacturing technologies. In 2018 13th IEEE Conference on Industrial Electronics and Applications (ICIEA) (pp. 2650-2655). IEEE.
• Zhang, C., & Li, H. (2020, June). A new method for EMC analysis of PCB based on finite element method. In 2020 International Conference on Wireless Communications, Signal Processing and Networking (WiSPNET) (pp. 1-5). IEEE.

书籍

• IPC-2222B (2017). Rigid printed circuit boards and multilayer boards—Design guidelines. IPC.
• IPC-6012E (2016). Qualification and performance specification for rigid printed boards and assemblies. IPC.
• Johnson, L. (1997). High-speed digital design: A handbook of black magic. Prentice Hall PTR.
• Oberg, E., Jones, F., & McCauley, H. (2016). Machinery's handbook: A reference book for the mechanical engineer, designer, production man, and mechanic. Industrial Press.
• Sutton, G. P. (2006). Electronic design: Circuit boards, microcontrollers, and VLSI. John Wiley & Sons.